SHINE Partnership Launch and Technical Seminar
June 30, 2022
News Highlights
- SHINE Partnership Launch and Technical Seminar
- June 30, 2022
On 30 June 2022, Singapore Hybrid-Integrated Next-Generation μ-Electronics (SHINE) centre held its first Partnership Launch and Technical Seminar. It directs its focus on promoting pioneering insights and breakthroughs while supporting innovations and collaborations. The Day 1 event was open to the public, professors, staff, researchers and industry collaborators at NUS, Kent Ridge campus, with over 180 attendees.
The guest of honour, BG Ng Chad-Son, Deputy Secretary (Technology), Ministry of Defence, graced the event with his presence. Prof Aaron Thean, Director of SHINE, opened the conference with a welcome address. Prof Thean outlined the motivation for establishing SHINE centre and its beliefs in research strategies specific to R&D and the research ecosystem that brings collaborative academic and industry partners across the semiconductor value chain to promote innovation through science and breakthrough technologies. Finally, he celebrated the initial collaborations with a first-anniversary commemorative video put together for this partnership launch and inauguration event.
The distinguished keynote speakers were Dr Suresh Venkatesan, Mr Guillaume Besnard, Prof Philip Wong, Prof Takao Someya and Dr Thomas J. Knisley. With esteemed invited speakers, namely, Prof Ahmed Busnaina, Mr Chin Jiann Min, Dr Surya Bhattacharya, Dr Vincent Leong and Mr Markus Bebendorf. During the conference, the speakers presented their topics and recommendations while sharing their insights on the latest technologies/advancements and development trends addressing the current limitations of system-on-chip integrations.
The seminar begun with a unique hybrid integration platform for wafer-scale passive assembly of electronics and photonics devices using a CMOS-based optical interposer from POET Technologies, Inc., substrate engineering for extending Moore’s law and more-than Moore applications, new and cost-effective additive manufacturing technology for nanoelectronics that can enable the industry to leverage novel properties of nanomaterials and their applications; semiconductor package failure analysis fault isolation methodologies; advancement of system-level performance by the fundamental device and process technologies, and how new materials and device technologies development can enable the chip integration into systems using MOSAIC (MOnolithic Stacked Assembled IC); stretchable thin-film electronics for robotics and next-era wearables for medical applications, key issues and prospects of electronic skin; high-value problems in the semiconductor industry for enhancing BEOL metallization and obstacles in advanced patterning schemes; areas for the realization of SiP integration for diverse industry applications; promising RF technologies and examples of RF frontend subsystem that can be potentially enabled by them and solutions/strategies to fulfil the requirements of high-performance computing connecting heterogeneous integration as a robust contributor with their challenges and possibilities.
During the registration and multiple breaks, the attendees viewed exhibits highlighting the latest innovations and advanced technologies developed by researchers from NUS, NTU, A*STAR, SIMTech, POET Technologies, industry. Moreover, during lunch, Professor Lim Yeow Kheng shared the latest state-of-the-art equipment at the SHINE laboratory at NUS, and Professor Chen Xiaodong shared the capabilities of the new SHINE Centre at Nanyang Technological University, Singapore. Furthermore, this session facilitated attendees to engage in technical discussions and exchanges with the representative exhibitors at the event space.
The SHINE centre, a new research platform, will strive to advance the flexible and rigid microelectronics while addressing the diverse challenges and fundamental issues arising in next-generation IoT technologies in Singapore’s Smart Nation Infrastructure. With its introduction of low-volume and high-mix products, unique material innovations and its creation of deep-tech manufacturing capability, it holds prospects of enabling technology disruptors by engaging industry players in the product development and translation of technology to industry.