The Future of Semiconductor Innovation is in Integration
SHINE is focused on the next frontier of semiconductor innovation — pathfinding technologies that can enable new levels of performance, functionality and integration for next-generation semiconductor systems.
As computing systems become more powerful and complex, continued progress increasingly depends on integrating diverse materials, devices, chiplets and functions into highly optimised systems. Heterogeneous integration creates new pathways beyond conventional device scaling — combining logic, memory, photonics, RF, sensing and power to unlock new levels of system performance and functionality.
SHINE addresses this challenge across materials, devices, integration and systems, pathfinding technologies for future heterogeneous semiconductor systems.
As part of Singapore’s RIE2030 Semiconductor Flagship Programme, SHINE 2.0 pathfinds next-generation heterogeneous integration technologies and builds pathways for promising research towards industry impact.
FROM PATHFINDING TO INDUSTRY IMPACT
The 7 Research Thrusts
Creating the Technology Stack for Next-Generation Heterogeneous Systems
Seven integrated research thrusts spanning system design, advanced materials, photonics, heterogeneous integration, communications and sensing, intelligent failure analysis and thermal management.
Thrust 1
New Design and System Enablement
Integrated design approaches spanning GaN power management, energy-efficient optical communications and scalable compute-in-memory systems
Thrust 2
Advanced Functional Materials
Advanced materials enable wafer-level bonding, liquid-metal thermal engineering and thermal management for 2.5D and 3D packaging
Thrust 3
Die-Level Heterogeneous Integration
Low-temperature BEOL photonics integrates on-chip light sources, photonic memory and dense die-level interconnects.
Thrust 4
Wafer-Level Heterogeneous Integration
Backside power delivery and multimodal co-design enable scalable, high-density wafer-level 3D integration.
Thrust 5
Compact Heterogeneous
Integration for Communication, Signal Processing and Sensing Applications
Compact heterogeneous integration combines antenna-in-package, system-in-package and advanced thermal solutions for high-performance applications.
Thrust 6
Intelligent Defect & Fault Localization for Heterogeneous Integration
Magnetic imaging and physics-guided analysis localize package defects across multiple sensing modes.
Thrust 7
Thermal Management for Heterogeneous Integration
Magnetically responsive microcapsules and ferrofluids provide targeted cooling and active thermal control.
Our Evolution
Evolving from a university research initiative to a key programme within national semiconductor flagship programme, part of Singapore’s Research, Innovation and Enterprise 2030 Plan (RIE2030).
Welcome to SHINE Centre.
Our success is built upon strong partnerships across academia, industry and government. Together, we are not only advancing scientific discovery, but also nurturing future talent, accelerating technology translation and contributing to a vibrant semiconductor innovation ecosystem.
Sponsors and Academic Partners
SHINE identifies high-value, industry-specific strategic technology challenges and develops differentiated capabilities to address them.
For partnership opportunities, click here.