Our Research
Advancing Heterogeneous Integration Across The Technology Stack
SHINE 2.0 brings together seven interconnected research thrusts spanning design, advanced materials, photonics, heterogeneous integration, thermal management, and intelligent defect and fault localisation.
Working across materials, devices, integration and systems, the thrusts address critical research challenges in heterogeneous integration and enable new approaches for next-generation computing, communications, sensing and intelligent electronic systems.
Seven Research Thrusts. One Integrated Vision.
Thrust 1 - New Design & System Enablement for Heterogeneous Integration
- Predictive-AI Die-Stacked Gallium Nitride Power Management for Power-Intensive Integrated Systems
- Highly-Integrated Energy-Efficient Transceiver Architectures for Optical Communications in Fully Depleted Silicon-On-Insulator Technologies
- System-Technology Co-Optimization for Scalable Compute-in-Memory System
Thrust 2 - Advanced Functional Materials for Heterogeneous Integration
- Functional Materials for Wafer-Level Bonding
- Advanced Liquid Metal-Based Thermal Engineering for High-Power Packaging
- Thermal Interface Materials and Gap-Fill Dielectrics for in 2.5D and 3D Packaging
Thrust 3 - Die-Level Heterogeneous Integratio-
- Low Thermal Budget Back-End-Of-Line-Compatible Advanced Photonics
- Photonics Integration of On-Chip Light Source
Thrust 4 - Wafer-Level Heterogeneous Integration
- Co-Design of Power Delivery for 3D Integrated Circuit with Backside Power Delivery Network and Universal Chiplet Interconnect Express (UCIe) Integration
- A Multi-Modal System-Level Integration Platform for Scalable Performance of Backside Power Delivery Networks
Thrust 5 - Compact Heterogeneous Integration for Communications, Signal Processing and Sensing
- Compact Heterogeneous Integration of Antenna-in-Package and System-in-Package
- Compact Integration and Demonstration of Thermal Management Solutions for Advanced Applications
- Heat Spreading Materials for Heterogeneously Integrated High-Power Applications
- Phased Array and Reconfigurable Array Demonstrators with RF-Photonic Co-Integration
Thrust 6 - Intelligent Defect & Fault Localization for Heterogeneous Integration
- A Multi-Modal Physics-Guided Platform for Defect Localization in Heterogeneous
Integration
a. Magnetic-Field-Imaging Based Defect Localization
b. Physics-Calibrated Failure Analysis Data Generation Platform
c. Physics-Guided Neural Network For Low-Data Failure Analysis
d. Integrated Multi-Modal Analysis Platform
Thrust 7 - Thermal Management for Heterogeneous Integration
- Advanced Ferrofluid-Based Thermal Management System for High-Power Electronics by
Magnetic Field Assisted Movement
a. Magnetically Actuated Ferrofluid with PCM Microcapsules
b. Magnetic Field–Driven Cooling Architecture and Control
