Investigator

— Co-Investigator —

Dr. Lim Yeow Kheng is a Professor of Electrical and Computer Engineering and Singapore Hybrid-Integrated Next-Generation µ-Electronics (SHINE) Programme Director at the National University of Singapore (NUS). He has more than 20 years of industrial experience in semiconductor foundries technology development and Outsourced Semiconductor Assembly and Test (OSAT) manufacturing and business operations. He started his career at GlobalFoundries Singapore in 2001 and subsequently joined STATS ChipPAC Pte Ltd as Deputy Director in 2011. His major interests are in Advanced Wafer-level Packaging and Wafer-level Integration Technology including Fan-out/Fan-in WLP, System-in-Package (SiP), Integrated Passive Device (IPD), Through-Si-Via (TSV) and Integrated 3D IC Packaging. He is a Senior Member of IEEE and had published extensively with patents filed on these technologies.

On the technical front, Dr. Lim is actively involved in international technical activities such as Chairman (2012-13), Vice Chairman (2019) and Treasurer (2010-11, 2016-18) of Singapore Reliability/ Electronics Packaging/ Electron Devices Chapter; Board Member (2015-22), General Chair (2014), Technical Chair (2012-13) and Technical Co-chair (2010-11) of International Symposium on Physics and Failure Analysis of Integrated Circuits; Treasurer (2015) of Conference on Electron Devices and Solid-State Circuits; Committee Member (2014-22) of International Interconnect Technology Conference Advanced Metallisation Conference Asian Programme; Technical Sub-committee Member (2009-22) of International Reliability Physics Symposium; Committee Member (2014-22) of Singapore National Working Group for Semiconductor Devices.