A Wafer Scale Hybrid Integration Platform for Co-packaged Photonics using a CMOS based Optical Interposer
April 1, 2022
Publication
- A Wafer Scale Hybrid Integration Platform for Co-packaged Photonics using a CMOS based Optical Interposer
- April 1, 2022
In this paper, we present a unique hybrid integration platform for wafer scale passive assembly of electronics and photonics devices using a CMOS based Optical Interposer. Our optical interposer enables seamless communications between electronics and photonics chips that are assembled on it using visually assisted passive flip chip bonding techniques. This unique integration platform is the first such platform in the industry adapted to directly modulated lasers and enables the world’s smallest single chip Transmit/Receive Optical engine for 100G-400G optical engines.
Researcher/Author: Suresh Venkatesan, James Lee, Simon Chun Kiat Goh, Brian Pile, Daniel Meerovich, Jinyu Mo, Yang Jing, Lucas Soldano, Baochang Xu, Yu Zhang, Aaron Voon Yew Thean, Yeow Kheng Lim
2022 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits)