Publication

Silicon photonics (SiPh) has been considered the mainstay for the development of 800G and beyond optical communication technology [1]. As such, SiPh has seen increasing demand for applications in on-chip signaling and data processing. This is in part, due to its low latency, CMOS-compatibility, near-zero electromagnetic interference and the potential for large bandwidth.

In this work, we showcase using a multi-axial slide-stop guided design and LAB to accomplish flip-chip bonding of P-down passively aligned directly modulated laser (DML) diode array onto the world’s smallest transmit and receive CMOS-based optical interposerTM.

The incorporation of rectangular slide-stop structures improve post-bond accuracy by 1.6X achieving a best-in-class relative axial offset of 0.13μm. High-precision bonder with laser-assisted bonding capability enables heterogeneous integration of optical components with higher packing density due to a small heat-affected zone radius of 280μm.

Researcher/Author: (1) POET Technologies – Simon Chun Kiat Goh; Bo Zhao; James Yong Meng Lee; Suresh Suresh Venkatesan (2) NUS ECE Dept / SHINE – Baochang Xu; Yu Zhang; Siah; Yeow Kheng Lim; Aaron Voon Yew Thean and (3) ASM Amicra – Rappl Sebastian

IEEE Xplore 2022 European Conference on Optical Communication (ECOC) 18 – 22 Sep 2022 Publication Download: https://ieeexplore.ieee.org/xpl/conhome/9979160/proceeding