September 28, 2022
BG Ng Chad-SonDeputy Secretary (Technology)Ministry of Defence
Prof Aaron TheanDirectorSHINE Centre
Hybrid Integration Platform for Co-Packaged Photonics Using POET’s CMOS Based Optical Interposer
Dr Suresh VenkatesanChairman & Chief Executive Officer POET Technologies, Inc
Accelerated Innovation: Materials Developments to Enable Continued Device Miniaturization
Dr Thomas J. KnisleyApplied Materials
3D MOSAIC of N3XT Chips: Domain-Specific Technology for Future Systems
Prof Philip WongElectrical EngineeringStanford University
Advanced Flexible Microelectronics
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Substrates Engineering for Microelectronics
Ms Nguyen Bich-YenSenior FellowSOITEC
Advanced Additive Manufacturing of Nano & Microelectronics
Prof Ahmed BusnainaWilliam Lincoln Smith Chair Professor, Distinguished Professor Northeastern University
Electronic Design Automation and Chip Design for Heterogeneous Integration
Prof Alberto Sangiovanni VincentelliButtner Chair of EECSUniversity of California, Berkeley
Advanced HI OverviewSystem-in-Package Integration for Diverse Applications
Dr Surya BhattacharyaMicroE 2.0 HI Task ForceDirector, A*STAR IME
RF Enabling Technologies
Dr Vincent LeongDirectorDSO
Future Integration Technologies for High-end Automotive Electronics
Mr Markus BebendorfGroup ManagerContinental Automotive
Latest Advancement in Semiconductor Package Fault Isolation
Mr Chin Jiann MinDirectorAMD Singapore
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