Low-Thermal-Budget BEOL-Compatible Beyond-Silicon Transistor Technologies for Future Monolithic-3D Compute and Memory Applications
January 23, 2023
Publication
- Low-Thermal-Budget BEOL-Compatible Beyond-Silicon Transistor Technologies for Future Monolithic-3D Compute and Memory Applications
- January 23, 2023
If Si CMOS for massive M3D is difficult due to need for high-thermal-budget processes, are there solutions that are beyond Si? In this article, we discuss two low-thermal budget approaches: Oxide Semiconductor and 2D Materials for M3D integration. By reviewing some of our recent work with IGZO-based transistors and memories, followed by our investigation of the 2D material opportunities for 3D memories, we highlight the need for new low-thermal-budget additive techniques for heterogenous multi-material integration as well as low-temperature material modification. Given the unlikelihood of “perfect materials”, new system architecture-material-device co-design intervention will be essential to capitalize on the specific trade-offs of the components.
Researcher/Author:
Aaron Voon-Yew Thean†, Evgeny Zamburg†, Shih-Hao Tsai, Chun-Kuei Chen, Maheswari Sivan, Baoshan Tang, Sonu Hooda, Zihang Fang, Jieming Pan, Jinfeng Leong, and Hasita Veluri.
Published in: 2022 International Electron Devices Meeting (IEDM)