September 11, 2024
Mr Kam Heng Lee (Kam) is currently the Senior Director and Deputy Head of the Advanced Packaging Technology and Service at TSMC. He has 29 years of experience in semiconductor industry, in package assembly technology development, test technology development, product development and high-volume manufacturing.
Previously, he held the role as Vice President of Product Development and Engineering at Intel. At TSMC, Kam is actively working with his colleagues to deliver advanced packaging and testing technologies to serve its foundry customers.
As Vice President of Corporate Development, Corporate Marketing, and IT at AEM, Samir Mowla develops, articulates, and implements AEM’s corporate development initiatives to drive its business strategies. He also oversees the corporate marketing and IT departments, ensuring alignment with the company’s strategic goals.
Samir is an experienced executive with extensive corporate finance knowledge, corporate strategy, and a strong technical background. Before joining AEM, Samir held two roles at Tan Chong International Limited for over five years. He was the Regional IT Deputy General Manager and Regional Software Solutions Senior Manager.
Mr Jared Holzwarth started his career in 2000 at the freshly formed Lumileds lighting company in Silicon Valley. Over a decade, he moved through different positions supporting the transition from two inch to six-inch LED manufacturing, ending with leading R&D Operations and Hardware Development teams. With a passion for Compound Semiconductors, he transitioned to more technological roles to create brighter and more uniform LEDs – ultimately bringing the first L-Prize bulb to fruition.
He relocated shortly afterwards to Germany to work at AIXTRON where he took various Technology leadership roles within a few years, introducing the first Cassette to Cassette automation to an MOCVD reactor. More recently, bringing the most productive 200mm Silicon Carbide Epitaxial system to life, enabling process scientists to constantly push physics boundaries in terms of material quality and uniformities without compromising on productivity. Leading all Technology developments since 2023, his team contributed to launch the G10 GaN for the production of GaN Power Devices, bringing these material classes into a new era of productivity and yields.
The Agenda
Event Location
Venue: National University of Singapore,
E7 Building, Level 3 Seminar Rooms
Address: 15 Kent Ridge Crescent, Singapore 119672
(Driver is advised to enter via Engineering Drive 1 and park at cark park C at Block E6)