Nanoscale Thermal Transport and Characterization for Heterogeneous Integration
Date: 1 Dec 2025
Time: 11:00 am to 12:00 pm
Venue: NUS, Block 6, #06-02 Eureka Seminar Room, 5 Engineering Drive 1, Singapore 117608
SHINE Management was honoured to host Professor Ali Shakouri from the Birck Nanotechnology Centre, Purdue University (USA), for an insightful seminar on “Nanoscale Thermal Transport and Characterisation for Heterogeneous Integration.” His visit provided an excellent opportunity for our community to engage with leading perspectives on nanoscale thermal behaviour, advanced metrology, and integration-driven research directions for next-generation electronics.
Seminar Highlights
Nanoscale Thermal Transport Physics
Professor Shakouri began by outlining the fundamental principles governing heat conduction at the nanoscale, establishing the physics foundation for understanding thermal behaviour in advanced materials and device architectures.
Advanced Characterization and Metrology
He then discussed state-of-the-art tools and techniques for thermal measurement, including image-processing-enabled fast thermal simulations and far-field thermoreflectance methods capable of achieving sub-diffraction-limit thermal imaging down to approximately 100 nm through image deconvolution. These approaches highlighted the growing importance of accurate, high-resolution thermal characterization for 3D ICs and heterogeneous systems.
Integration-Oriented Research Directions
The seminar further explored multiscale and system-level thermal challenges in heterogeneous integration. Key themes included interface and interconnect thermal resistance, in-plane and through-plane thermal coupling in 2.5D/3D stacks, transient versus steady-state thermal behaviour under operational loads, and emerging data-driven and AI-assisted approaches for predictive thermal analysis.
The seminar concluded with strong participation and a lively Q&A session that encouraged in-depth discussion and critical engagement, reflecting the session’s significant contribution to advancing understanding in nanoscale thermal transport and characterization.
