- SHINE 7th Technical Workshop
3 February 2026
The 7th SHINE Technical Workshop was successfully held on 3 February 2026 at the NUS Block E7 Seminar Room, bringing together researchers, consortium members, industry partners, and technical experts to exchange insights on hybrid-integrated microelectronics, advanced packaging, and emerging materials technologies.
The workshop commenced with a welcome address by Professor Aaron Thean, who reviewed SHINE Centre’s progress since 2021 as a national R&D centre for heterogeneous integration. He highlighted SHINE’s role in bridging materials, processes, and design, including the development of key hybrid-flexible technologies. He also outlined SHINE’s contributions to strengthening Singapore’s semiconductor talent pipeline through the Master of Science in Semiconductor Technology & Operations.
Emphasising the workshop as a platform for cross-disciplinary engagement and academia-industry collaboration, he also shared a forward-looking perspective on SHINE’s next phase, outlining the SHINE 2.0 initiatives under the RIE Flagship and their sustained, scaled impact on hybrid-integrated microelectronics.
The workshop featured presentations from six invited experts in advanced systems and microelectronics, including:
- Kaustav Banerjee (Professor of Electrical and Computer Engineering and Director of the Nanoelectronics Research Lab, University of California) presented the advances in two-dimensional materials as platforms for scalable 3D nanoelectronics and monolithic 3D integration.
- Prof Radha Nagarajan (SVP and CTO, Optical Engineering, Marvell Technology) highlighted the challenges of optical connectivity technologies in the AI era, particularly the need for high-speed, low-power interconnects to support large-scale AI data centres.
- Subramanian S. Iyer (Distinguished Professor, Department of Electrical Engineering, University of California) discussed advanced electronics packaging strategies to sustain system-level scaling beyond CMOS, highlighting chiplet-based architectures and heterogeneous integration as enablers of scalable next-generation computing systems.
- Dr Alfred Yeo (R&D Director, STATS ChipPAC Singapore) presented packaging challenges and process innovations, showing how advanced packaging and interconnects are redefining microelectronics.
- Dr Shyam Surthi (Distinguished Member of Technical Staff, Micron Technology, Inc.) explored the advanced packaging roadmap for DRAM and NAND, highlighting memory-centric heterogeneous integration techniques to meet the performance and scaling demands of AI-centric architectures.
- Dr Jack Sheng Kee (Senior Director, Silicon Photonics Business Division, Delta Electronics) shared insights on advanced laser integration and packaging techniques for high-performance silicon photonics, enabling cutting-edge optical communications, LiDAR, and sensing systems.
The workshop included technical sharing sessions, exclusive to the SHINE consortium research community and related project industry collaborators, where SHINE co-investigators and researchers presented progress from SHINE’s four strategic thrusts:
- What Are Quantum Computers and the Role of Semiconductors in This Field – by Prof Alberto Sangiovanni-Vincentelli, SHINE Thrust 1 Research Collaborator, University of California, Berkeley, USA.
- 2D Materials-Based Composites for Flexible Sensors and Thermal Management – by Prof Lee Pooi See, SHINE Thrust 2 Co-Investigator, NTU.
- Advanced Materials and Interfaces for Heterogeneous Integration – by Li Yanzhen, SHINE Thrust 2 Research Fellow, NTU.
- SHINE Design Enablement and Innovation: Learnings from Chiplets to Methodologies – by Prof Massimo Alioto, SHINE Thrust 1 Co-Investigator, NUS.
- Thermal Management Solutions for Flexible Antenna Array – by Dr Jiang Yizhou, SHINE Thrust 3A Research Fellow, NUS.
- Flexible Phased Array Demonstrators – by Prof. Koenraad Mouthaan, SHINE Thrust 3B Co-Investigator, NUS.
- Design and Development of the Si/SiC Interposer – by Dr Lim Teck Guan, Senior Scientist (System-in-Package), A*STAR IME.
- 3D-Printed Freeform Micro-Optics for Light Source Packaging and Integration – by Dr Chua Yun Da, SHINE Thrust 4 Research Fellow, NUS.
The SHINE 7th Technical Workshop provided participants with timely insights into emerging materials, integration strategies, and high-performance microelectronics applications, while facilitating cross-disciplinary collaboration and engagement with industry.
Professor Lim Yeow Kheng, Programme Director at the SHINE Centre, concluded the seventh SHINE Technical Workshop—the final workshop of the SHINE 1.0 programme—highlighting SHINE’s role in advancing Singapore’s hybrid-integrated microelectronics ecosystem and accelerating the translation of research breakthroughs into practical, industry-ready solutions.
SHINE extends its special thanks to all speakers, presenters, collaborators, and participants for their contributions, whose expertise and engagement underpin SHINE’s mission.
