Photonic Wire Bonds and Facet-Attached Micro-Lenses: Scalable Hybrid Integration of Lasers and PICs
Date: 20 Jul 2026
Time: 10:00 am to 11:30 am
Venue: NUS, Block 6, Eureka Seminar Room, 5 Engineering Drive 1, Singapore 117608
SHINE Management had the pleasure of welcoming Dr Sebastian Skacel, Director of Sales, Applications and Services at Vanguard Automation, for a seminar titled “Photonic Wire Bonds and Facet-Attached Micro-Lenses: Scalable Hybrid Integration of Lasers and PICs.” The seminar highlighted emerging approaches for advancing photonic integrated circuit (PIC) technologies and fostered meaningful discussions among researchers and students on hybrid integration strategies for next-generation photonic systems.
Key highlights of the seminar included:
- Examining the challenges associated with integrating lasers and other active optical components into photonic integrated circuits (PICs) to enable scalable, high-volume manufacturing.
- Showcasing Vanguard Automation’s in-situ 3D nano-printed photonic wire bonds and facet-attached micro-lenses as innovative enabling technologies that support low-loss optical coupling, passive alignment, relaxed assembly tolerances, and scalable batch- and wafer-level manufacturing.
- Exploring hybrid photonic integration approaches across key material platforms, including silicon photonics (SiPh), indium phosphide (InP), and thin-film lithium niobate (TFLN).
- Highlighting the potential of these technologies in advancing next-generation optical systems, with applications spanning telecommunications, sensing, quantum technologies, and space systems.
The team thanks Dr Skacel and all participants for their valuable engagement and contributions to this knowledge exchange.
