SHINE 5th Technical Workshop
October 3, 2024
The SHINE 5th Technical Workshop was held on October 3, 2024, at the NUS E7 Building, Level 3 Seminar Rooms. The event focused on advancing packaging technologies, hybrid electronics, and innovative materials, while addressing industry trends and challenges to promote co-development collaborations. The workshop attracted a diverse audience of professors, staff, researchers, and industry collaborators, contributing to its success.
Professor Aaron Thean, Director of SHINE, opened the workshop with a welcoming address, emphasizing SHINE’s vision to tackle challenges in hybrid integration through its focus on packaging technologies and hybrid electronics. He shared highlights of SHINE’s current work packages and provided a glimpse into the afternoon session, which would include the presentation of a novel BEOL device architecture for 3D memory and an ultra-sensitive, flexible printed resistive strain sensor designed for harsh environments—both of which are featured in a recent SHINE paper accepted by IEDM.
Three distinguished industry speakers were featured during the event:
Mr. Kam Lee, Senior Director and Design Head of Advanced Packaging Technology and Service at TSMC, presented TSMC’s product roadmap for advanced packaging. He illustrated how performance scaling is being extended through system integration, driven by AI mega trends and High-Performance Computing (HPC) demands. He emphasized TSMC’s pivotal role in enabling chiplets through advanced packaging and testing technologies to meet these performance demands.
Mr. Jared Holzwarth, Vice President of Technology at AIXTRON SE, delivered an insightful talk on AIXTRON’s leadership in Metal-Organic Chemical Vapor Deposition (MOCVD) technology. He emphasized how controlling volume production of low-cost compound materials opens new opportunities for the semiconductor market. Mr. Holzwarth outlined AIXTRON’s journey from small reactors to fully automated systems, enabling scalable production without compromising quality or cost, and described how AIXTRON has facilitated the transition of materials from research to high-volume manufacturing.
Mr. Samir Mowla, Vice President of Corporate Development at AEM, discussed the primary challenges in semiconductor device testing, especially in light of HPC, AI, and mobile communication advancements. He highlighted innovative testing methodologies, including solutions for thermal spikes, and explored how companies are maintaining product quality while managing cost-effectiveness in an increasingly complex and competitive landscape.
The morning sessions concluded with Prof. Lim, who provided an overview of SHINE’s research activities and highlighted the centre’s focus on new material innovations and flexible electronics. He encouraged continued collaboration with SHINE to drive future advancements in hybrid electronics.
For SHINE consortium members only, the afternoon workshop featured a total of 9 professors and researchers from NUS, NTU, University of Berkely, California from Thrust 1 to Thrust 4, and A*Star, who share their respective research works and highlights.
- Flexible Antenna System: Thermal Management and Integration Challenges by NUS Senior Research Fellow, Dr Evgeny Zamburg, SHINE Thrust 3.
- Design and Preparation of Printable Inks for Thermal Management and Energy Harvesting by NTU Senior Research Fellow, Dr Hyunwoo Bark, SHINE Thrust 2.
- Manufacturing Roadmap of Flexible Hybrid Electronics by NTU Professor, Chen Xiaodong, SHINE Thrust 2, Co-Investigator and SHINE Deputy Director.
- NUS presented ‘Innovative Flexible Antennas for Conformable Phased Arrays’ by NUS Professor, Koen Mouthaan, SHINE Thrust 3, Co-Investigator.
- Design of Through Silicon Interposer for 2.5D Heterogeneous Integration for High-mix Application: From Wafer to Functional Packaging by A*Star IME Scientist, Dr Zhou Lin.
- Semiconducting Single-walled Carbon Nanotube Thin Film Transistor (sSWCNT-TFT) via Jet Nebulizer Spray Pyrolysis (JNSP) by NUS Research Fellow, Dr Murugan Balaji, SHINE Thrust 4.
- Hierarchical Bound States and Anderson Phases in Topological Heat Transport’ by NUS PhD Student, Mr Yang Shui Hua, SHINE Thrust 4.
- Pushing SHINE Innovation to a Complete Ultra-Low Power Chiplet Ecosystem with Silicon Demonstrations by NUS Professor, Massimo Alioto, SHINE Thrust 1.
- From Automated Design to Heterogeneous Integrated Electronics by University of California, Berkeley USA Professor, Alberto Sangiovanni- Vincentelli, SHINE Thrust 1, Research Collaborator.
In conclusion, the SHINE 5th Technical Workshop was an invaluable opportunity for attendees to gain insights into cutting-edge technology developments in advanced packaging, testing, and materials development, all essential to addressing the evolving needs of the semiconductor industry.
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