SHINE 6th Technical Workshop
June 1, 2025
Speaker Biography of Invited Talks (more info is available in the event booklet)
Prof. Lim Yeow Kheng is the Programme Director of the SHINE Centre and the Master of Science in Semiconductor Technology and Operations (STO) programme at the National University of Singapore (NUS). He also serves as Assistant Dean (Research and Technology) and Professor in the Department of Electrical and Computer Engineering at the College of Design and Engineering.
With over 20 years of industry experience in semiconductor technology and OSAT manufacturing, Prof. Lim has held leadership roles at GlobalFoundries and JCET Group. His research interests span advanced wafer-level packaging, heterogeneous integration, nanomaterials, flexible electronics, and AI/ML applications. He is a Senior Member of IEEE, holds multiple patents, and is active in numerous local and international technical committees and conferences in microelectronics and packaging technologies.
Mr Chris Sim serves as the Director of Package Development Engineering (PDE) at Micron Technology, where he spearheads strategic initiatives across HBM, NAND, and DRAM technologies. In this role, he leads advanced packaging, technology development, package integration, industrial engineering, digital twin implementation, and key equipment teams-accelerating innovation and the deployment of next-generation silicon technodes.
Chris joined Micron in 2015 as a Product Engineer focused on SSD and Module Solutions. Since then, he has earned recognition for his deep technical expertise and cross-functional leadership, playing a pivotal role in advancing Micron’s memory and storage innovations.
He holds a Bachelor’s degree in Electronics Engineering with a specialization in Bioinstrumentation from Multimedia University, Malaysia (2010), and an MBA from Singapore Management University (2021), equipping him with a strong blend of technical insight and business strategy.
Mdm Madhu Stemmermann, CEO and Co-Founder, SunRay Scientific Inc., has 25 years of experience in executive leadership roles across manufacturing, supply chain, sales and product management spanning various industries such as electronics packaging, conductive adhesives, medical devices, LED lighting and engineered plastics. She was the youngest and first female Plant Manager appointed at Philips Lighting. She has led and executed various company transformations and acquisitions. Mdm Madhu received her degree in Chemical Engineering from Purdue University, West Lafayette, IN.
Mr. Dontireddy, Kalivaraprasad Reddy started his carrier in 2010 after finishing his master’s degree in Microwave Engineering from IIT BHU. He joined Bosch as EMC engineer and later moved to Stuttgart, Germany, where he worked on automotive electronics with a focus on EMC.
Subsequently, he Joined Visteon and then Cummins as a Technical Specialist in High Speed and EMC simulations domain. He played a key role in developing simulation methods and processes to achieve signal integrity (SI) and EMC compliance.
In 2017, he relocated to Singapore to work at Continental Automotive where he currently serves as a Senior Expert in high-speed design and EMC simulation. He has extensive experience in designing memory interfaces like LPDDR4 along with display interfaces like LVDS and eDP etc. Additionally, he has developed methodologies for in-house FPC designs with special ground structures to meet SI and EMC requirements. His research interests include exploring alternative techniques for achieving EMC compliance and leveraging AI in high-speed design.
Dr Ajay Virkar is Vice President Advanced Circuits and Packaging at DuPont, focusing on business and technology development initiatives. Prior to this role, he was the Co-founder, CTO, and a Board Member of C3Nano—an advanced materials company acquired by DuPont in August 2024. At C3Nano, Dr Ajay played a pivotal role in securing multiple rounds of strategic and venture funding, commercializing new technologies used in some of the world’s first flexible consumer electronic devices. He led the development of intellectual property, technology innovation, and managed key partnerships across the global consumer electronics supply chain.
Dr Ajay is a co-inventor on over 100 issued patents and has co-authored 13 peer-reviewed journal articles. In addition to supporting multiple hardware and materials startups, he advised the U.S. Department of Energy (DOE)’s Perovskite Solar Initiative. Beyond to his technical work, Dr Ajay served as an associate producer for Infinite Potential, a documentary about physicist David Bohm. He earned his BS from the University of Illinois and his PhD from Stanford University where his thesis was awarded the Spinger Prize.
Dr. Sudheer Kumar is presently working as COO, National Centre for Flexible Electronics, IIT Kanpur. He has over 24 years of experience in working academics and industries mainly in Solar Energy, Displays, Semiconductor and Electronics Industries spanning across globally. He has earlier served many key top positions in various industrial organizations and some of them are – Flisom AG, Switzerland, Tata Industries Ltd, Moserbaer Solar Ltd. and SAMTEL Color Ltd. His main contributions belong to the areas of project conceptualization, Operations, Supply Chain Management, Business development / management, Evaluation of many companies, Technology Transfers, value engineering and startup projects with chronicle success of driving benchmarks, setting-up growth and expansion for reputed organizations. His main areas of interests / specialization are – Organic Semiconductor, Flexible Electronics, Flexible Solar, Smart Packaging, Displays, Large Fab Engineering and Operations.
Born in Kobe, Japan, in 1985, Mr Shimizu Ryota has built a career that seamlessly combines international business expertise with cutting-edge technological innovation. He began his professional journey at Satosen as an international sales representative, where he excelled in cultivating strong client relationships and navigating the complexities of global commerce. This role laid a solid foundation for his deep understanding of diverse customer needs and market dynamics.
Motivated by a passion for innovation, Mr Shimizu transitioned to Satosen’s Research and Development department, where he focused on advancing next-generation printed circuit boards (PCBs), with a particular emphasis on stretchable PCBs. This pioneering technology holds significant promise for applications such as wearable electronics and flexible sensors.
In his R&D role, Mr Shimizu collaborated closely with a wide range of customers, managing projects from initial concept through to mass production. His work sharpened his ability to translate complex technical ideas into practical, real-world solutions. He has also been deeply involved in the research of stretchable PCBs incorporating liquid metal, a cutting-edge area at the forefront of flexible electronics.
Prof Ng Geok Ing received his Ph.D degree in electrical engineering from the University of Michigan, Ann Arbor. Currently, he is a professor at the Nanyang Technological University (NTU) Singapore in the School of Electrical and Electronic Engineering. His current research interests include Gallium Nitride (GaN) High-Electron-Mobility Transistors (HEMTs) for Monolithic Microwave Integrated Circuit (MMIC) applications. He has authored and co-authored more than 350 international journal and conference papers and delivered plenary and invited talks at several international conferences. He holds two granted patents and 5 filed patents. Currently, he serves as the Centre Director of the National GaN Technology Centre (NGTC) for advanced R&D and manufacturing of GaN-on-Si and GaN-on-SiC devices and ICs for RF-mmWave applications. He is serving as the member of the IEEE Electron Device Society Board of Governors, Editor of the IEEE Journals of Electron Device Society (JEDS) and Editorial Board Member of the open access journal Electronics. He is the recipient of the prestigious Defense Technology Prize Awards for the significant technological contributions to the MMIC R&D Team (R&D Category) in 2007, and the Individual (R&D) Award for the significant technological contributions in building up Singapore’s indigenous R&D capabilities in Gallium Nitride MMIC technologies for defense applications in 2023.
Dr. Xianshu Luo received his Ph. D. degree in Electrical and Computer Engineering from The Hong Kong University of Science and Technology (HKUST), Hong Kong, in 2010. He joined Institute of Microelectronics (IME), A*STAR, Singapore, as a Research Scientist in 2010, where he engaged in research on silicon photonic integrated circuits (Si-PIC), heterogeneous integration of optoelectronic integrated circuits (H-OEIC). In 2017, he joined Advanced Micro Foundry Pte. Ltd., as a Co-Founder and Research Manager, and later Research Director, working on the device performance advancement, and silicon photonics for advanced applications. He returned IME, A*STAR as Principal Scientist in 2023, and jointly appointed as VP, Advanced Photonics at National Semiconductor Translation and Innovation Centre (NSTIC) in 2024. He is leading the development of next-generation advanced photonics via photonic heterogenous integration (PHI) in IME an NSTIC.
Dr. Luo is the Fellow of Optica Society, Fellow of A*STAR, Senior Member of IEEE/IEEE Photonic Society, and Member of Project Management Institute. He is now serving as the Associate Editor for Optica Photonics Research. He served as the Associate Editor of IEEE Photonics Technology Letters and the Guest Editor for IEEE Journal of Selected Topics in Quantum Electronics focus issue in “Hybrid Integration for Silicon Photonics”. He has been serving as the steering committee member of IEEE Silicon Photonics Conference since 2019. He has also been serving as the Technical Committee Chair / Co-Chair / Member for various international conferences. Dr. Luo has authored/co-authored more than 200 peer-reviewed journal and conferences papers, 5 book chapters, and holds more than 30 patents and patent applications.
Mr. Vempati Srinivasa Rao is Director and Head of Heterogeneous Integration Department at Institute of Microelectronics (IME), Singapore. He has over 20 years of R&D experience in microelectronics packaging, assembly, reliability, and failure analysis. He leads development of advanced wafer level packaging platform technologies and process/integration capabilities such as fine pitch multi-layer RDL, TSV interposer, W2W and C2W Hybrid Bonding required for heterogeneous chiplet integration. He has authored or co-authored more than 80 journal and conference publications in electronic packaging area. His research interest includes chiplet integration using Fan-out wafer level packaging, 2.5D packaging, 3D chip stacking. He received a Masters Degree in Mechanical Engineering with Material Science Specialization from the National University of Singapore, and Bachelor Degree in Metallurgical Engineering from the National Institute of Technology, Warangal, India.
The Agenda
Event Location
Venue: NUS College of Design and Engineering Campus,
Block EA, Auditorium, 9 Engineering Drive 1, S(117575)
Driver is advised to enter via the Engineering Drive 1 and park at car park 2A/2B.
