June 30, 2025
The SHINE Open Plenary, held as part of the SHINE 6th Technical Workshop at NUS, followed the SHINE-sponsored IEEE FLEPS 2025 Industry Plenary in the morning. The Open Plenary session, from 2:00 pm to 3:35 pm, was open to the public and provided a platform for knowledge exchange on cutting-edge developments in hybrid electronics and advanced materials.
The session commenced with a welcome address by Prof. Chen Xiaodong, Deputy Director of SHINE Centre, who reiterated SHINE’s commitment to breakthroughs in material innovation, flexible electronics, and heterogeneous integration. Prof. Chen emphasized the vital role of collaborative partnerships in advancing the field and translating research into impactful solutions.
Three distinguished industry speakers were featured during the SHINE open plenary sssion:
Prof. Ng Geok Ing (Centre Director, National GaN Technology Centre, NTU) presented recent advances and market projections for GaN-on-Si technology in RF applications, especially for 5G/6G and low-voltage mobile mmWave front-ends. He showcased NGTC’s infrastructure and capabilities in rapid prototyping and small-volume production, underscoring both the challenges and opportunities in commercializing RF GaN-on-Si technology, as well as the importance of developing a robust local ecosystem.
Dr. Luo Xianshu (Vice President of Advanced Photonics, NSTIC) discussed the evolution of silicon photonics and its critical role in enabling high-speed, low-cost optical transceivers for data centers. He outlined the limitations of traditional silicon photonics, the need for heterogeneous material integration, and NSTIC’s progress in new material platforms such as H-free CVD SiN and AlN-based photonics to drive next-generation device performance and manufacturability.
Mr. Vempati Srinivasa Rao (Director, Heterogeneous Integration, A*STAR IME) highlighted advanced packaging technologies enabling multi-chiplet heterogeneous system-in-package (SiP) solutions for generative AI and high-performance computing (HPC). He detailed IME’s initiatives in interconnect scaling, packaging for AI/HPC, system-level thermal management, and collaborative R&D efforts with industry and academia to accelerate innovation in advanced packaging.
Technical Presentations and Consortium Sharing (Closed Sessions):
Following the Open Plenary, the technical workshop sessions were accessible exclusively to SHINE consortium members and the research community. Over the two-day workshop from 24 to 25 June 2025, eight presentations covered SHINE’s four project thrusts, including:
The SHINE 6th Technical Workshop provided attendees with valuable insights into emerging technologies, industry trends, and collaborative opportunities across hybrid electronics and related fields. The event reinforced SHINE’s pivotal role in fostering a hybrid-integrated next-generation microelectronics system ecosystem and expediting the translation of academic research into practical, industry-ready innovations.
The Photo Gallery