Past Events 2023

SHINE 3rd Technical Workshop September 13, 2023

Post Event Report

SHINE 3rd Technical Workshop

September 13, 2023

The third technical workshop of the Singapore Hybrid-Integrated Next-Generation μ-Electronics (SHINE) Centre was held on 13 September 2023 at Block E7 in the NUS College of Design and Engineering Campus. The event was a one-day seminar that included a series of invited talks from industries, reporting on research outcome of four research thrusts by co-investigators and researchers from NUS, NTU, DSO and A*Star. The seminar focused on promoting groundbreaking material discoveries aimed at shaping the future of semiconductor and heterogenous-integration technology while nurturing innovation and encouraging collaboration within the industry. The morning event was open to the public and attended by professors, staff, researchers, and industry collaborators, garnering close to 160 participants.

The welcome address by Prof Aaron Thean, Director of SHINE, began with an appreciation of participants and guests, Chief Executive Officer, NRF, including partners of SHINE, for gracing today’s event. He outlined the motivation behind establishing the SHINE Centre and its belief in research strategies with a convergence of new material innovations and collaborations in the research ecosystem.

The inspiring opening address by Mr Beh, Chief Executive Officer, NRF, set the tone for a day filled with profound knowledge-sharing and collaboration. Mr. Beh eloquently emphasized the far-reaching significance of this innovation economy, underscored the impact of electronics in shaping the trajectory of our world, Research Innovation and Enterprise’s (RIE) pivotal role in providing resources to push frontier science and innovation and the importance of leadership in serving our society.

Followed on were the plenary talks by three distinguished speakers from the industry, namely Professor Radha Nagarajan, Dr Barund Dutta and Dr Myung-Hee Na.

Our journey through innovation and technological advancement began with the first invited speaker, Professor Radha Nagarajan, Senior VP and CTO of the Optical and Copper Connectivity Group at Marvell. Prof. Nagarajan’s captivating talk on “2.5D/3D Heterogeneous Optical Integration” explored the merger of electronics and optics into a single active silicon photonics interposer to form a higher-level component. The process facilitates the component fusion independently designed and optimized from several technology and foundry platforms into a common interposer. As demonstrated, heterogeneous integration is paramount for achieving higher-speed and higher-performance components in our rapidly evolving digital landscape.

At the end of Prof. Nagarajan’s presentation, Prof. Aaron Thean was thrilled to announce the Two Hundred Thousand Singapore dollar cash donation from Marvel. He thanked Prof. Nagarajan for the support and informed that the funds will play a vital role in advancing pioneering microelectronics research at the SHINE Centre.

Our second invited speaker, Dr Barund Dutta, Chief Scientist at Imec, presented a groundbreaking review of his work on developing a high-channel-count electrophysiology device, “Neuropixels probe.” Dr Dutta’s presentation illuminated the path towards another remarkable 10-50X increase in neural recording capacity, offering a glimpse into the ambitious goal of recording from the entire brain. He shared preliminary exploratory results of a specific neuro-modulation application and the transformative power of a CMOS-integrated platform capable of co-integrating various modalities, including integrated optics/photonics. Furthermore, Prof Dutta illustrated a few transformational neuroscience experiments to demonstrate that this technology is facilitating the Neuropixels ecosystem’s potential of charting a new path to enable collaborative science between advanced tool builders and scientists, with a transformational impact.

Dr. Myung-Hee Na, VP of the Revolutionary Technology Center at SK Hynix, was the final speaker at the morning workshop. Her presentation, “Making Small, Creating Big – Semiconductor Innovation,” took us through the “Continuity, Expansion, and Change” in memory innovation. This cycle emphasized the importance of memory innovation in today’s data-centric era. The discussion began with the need to continue Moore’s law in current memory products like DRAM and NAND, followed by expanding into emerging memory technologies for new applications. Dr Na introduced interfaces like Compute-Express-Link (CLX) and explored chalcogenide-based materials for improved performance and process simplicity, surpassing existing industry solutions. This journey ultimately aimed to break down the boundaries between computer and memory, leading to the concept of “Beyond Memory.”

After the three plenary sessions, Prof Lim reiterated SHINE’s mission, strategy, approach, and benchmarking/positioning while providing an overview of its research activities and highlighting microelectronics innovation challenges and opportunities, its facilities and key capabilities, SHINE hybrid electronics research and empowering innovation through strategic partnership.

The SHINE 3rd Technical Workshop in the morning successfully concluded, thanks to the remarkable insights of our plenary speakers, dedicated participants, and the support of our sponsors and organizing committee. The event served as a forum for sharing knowledge, fostering collaboration, and building connections, pivotal in propelling the industry and promoting its development..

The afternoon workshop was restricted to SHINE consortium research collaborators. We extend a big thank you to all the co-investigators of SHINE research Thrusts 1 to 4 and the respective researchers for sharing their remarkable research outcomes.

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Fault Location In Circuitry Using Magnetic Field June 28, 2023

Overseas Speaker Talk Series – Post Event Report

Fault Location In Circuits Using Magnetic Field Imaging

Date: 28 June 2023, Wednesday

Time: 10.30 to 11.30 am

Venue: Block E6, #06-02, 5 Engineering Drive 1, Singapore 117608

On June 28, we had the privilege of hosting Professor Venkatesan (aka Prof Venky), Director of the Center for Quantum Research and Technology at the University of Oklahoma, as the overseas speaker for a talk titled “Locating the Coordinates of Faults in Electrical Circuitry.” The event took place at the campus of College of Design and Engineering and aimed to explore the importance of identifying faults in various electrical circuitry and the utilization of magnetic fields and x-rays for fault analysis.

Key Discussion Points:

Increasing Yields and Advancing Next-Generation Electronic Technology:
Prof Venky emphasized the crucial role of fault analysis in improving yields and advancing electronic technology. He highlighted the significance of accurately locating faults to identify areas for improvement and optimize the manufacturing process. The discussion shed light on the importance of addressing faults promptly to minimize production delays and reduce costs.

The Unique Properties of Magnetic Fields and X-rays:
Prof Venky discussed the unique characteristics of magnetic fields and x-rays as enabling media for fault analysis. He emphasized that these modalities are not easily absorbed by the materials used in circuitry fabrication, making them suitable for non-destructive fault analysis. This insight highlighted the potential of magnetic field and x-ray imaging techniques in fault analysis processes.

Pressing Need for 3D Defect Localization:
The rapid growth of advanced packaging techniques has created a pressing need for the localization of defects in three dimensions. Traditional fault analysis techniques relying on photons, electrons, heat, and sound are gradually being replaced by magnetic field and x-ray imaging methods. Attendees gained valuable insights into the challenges associated with fault analysis in three-dimensional structures and how magnetic field and x-ray imaging offer promising solutions.

Complementary Nature of Magnetic Field and X-ray Imaging:
Prof Venky emphasized the complementary nature of magnetic field and x-ray imaging techniques. He explained that while x-rays primarily detect density differences, magnetic field imaging directly captures electrical characteristics, providing valuable additional information. The combination of these two modalities enhances fault analysis capabilities and enables more accurate defect localization.

Neocera Magma – The Magnetic Field Imaging System:
During the talk, Prof Venky introduced MAGMA, the magnetic field imaging system from Neocera. He shared details about the system, which utilizes two quantum sensors: a superconducting quantum interference device (SQUID) and a giant magneto-resistive sensor (GMR). He discussed the operation, advantages, limitations, and possible future roadmap for the MAGMA system, providing the attendees with valuable insights into the practical implementation of magnetic field imaging techniques.

Question and Answer Session:

The talk included an engaging question and answer session where attendees actively participated. Prof Venky addressed various queries related to the magnetic field and x-ray imaging techniques, associated equipment and technologies, and the potential applications of AI in their adoption. The interactive session allowed for a deeper understanding of the topics discussed and provided valuable clarification for the attendees.

Token of Appreciation:

At the end of the talk, Professor Lim Yeow Kheng, the Programme Director of the SHINE Centre, presented Prof Venky with a token of appreciation. The gesture recognized Prof Venky’s valuable insights into emerging technologies for fault analysis in 3D structures.

About the Speaker

Prof. T. Venkatesan is a distinguished academic and researcher with an impressive background. He currently serves as the Director of the Center for Quantum Research and Technology at the University of Oklahoma and is affiliated with NIST Gaithersburg. Prof. Venkatesan is also the founding Director of the Center of Optimal Materials for Emerging Technologies at the University of Oklahoma. Previously, he held positions such as Director of the Nano Institute at the National University of Singapore and various roles at Bell Labs and Bellcore.

Prof. Venkatesan is renowned for his contributions as the inventor of the pulsed laser deposition (PLD) process and has an extensive publication record of over 800 papers and 34 patents. He is highly regarded in the scientific community and is recognized as one of the top physicists globally, ranked 66th in 2000 based on citations. He has mentored numerous students, having supervised over 56 PhDs, 35 Post Docs, and over 35 undergraduates.

In addition to his academic pursuits, Prof. Venkatesan is actively involved in entrepreneurship. He is the founder and Chairman of Neocera and Neocera Magma, companies specializing in PLD and magnetic field imaging systems. He is also a co-founder of Blue Wave Semiconductors. Prof. Venkatesan has played a key role in launching healthcare companies in Singapore, namely Cellivate and Breathonix, and many of his students have become entrepreneurs, establishing over 25 different commercial enterprises.

Prof. Venkatesan holds prestigious fellowships and memberships in various organizations, including the Royal Society, National Academy of Inventors, Singapore National Academy of Science, and Asia-Pacific Artificial Intelligence Academy, among others. He has received numerous awards and honors throughout his career, including the Bellcore Award of Excellence, George E. Pake Prize, and Distinguished Lectureship on the Applications of Physics Award from the American Physical Society. He is also actively involved in professional committees and has served as a Guest Professor at Tsinghua University and held positions in APS and UMD committees. He has been recognized with outstanding alumnus awards from Indian Institute of Technologies in Kanpur and Kharagpur, India.

SHINE 2nd Technical Workshop March 2, 2023

Post Event Brief

SHINE 2nd Technical Workshop

March 2, 2023

The second technical workshop of the Singapore Hybrid-Integrated Next-Generation μ-Electronics (SHINE) centre was held on 1-2 March 2023 at Block E7 in the NUS College of Design and Engineering Campus. The event was a 2-day seminar that included a series of invited talks from both academia and industries, as well as a workshop to report on research work by SHINE PIs and researchers of the four research thrusts E7 in the NUS College of Design and Engineering Campus.

The seminar focused on advancing novel material discoveries for future semiconductor technology while fostering innovation and industrial collaboration. Open to the public, professors, staff, researchers, and industry collaborators, the first day of the event drew in more than 150 participants.

The welcome address was given by Prof Aaron Thean, Director of SHINE, who outlined the motivation behind establishing the SHINE centre and its belief in research strategies specific to R&D and the research ecosystem.

Ten esteemed speakers presented on the first day of the event, including Mr Chris Sim, Director of Packaging Development Engineering of Micron Semiconductor Inc., Dr Suresh Venkatesan, CEO of POET Technologies, Prof Takao Someya of the University of Tokyo, Dr Walter Schwarzenbach, Technology Manager of SOITEC, Dr Desmond Lim, Deputy CEO (Technology) of DSO National Laboratories, Glenn Vandevoorde, CEO of iCana, Prof Aaron Thean of the National University of Singapore, Prof Chen Xiaodong of Nanyang Technological University, Dr Surya Bhattacharya Director, System-in-Package of A*STAR IME, and Prof Alberto Sangiovanni-Vincentelli University of California, Berkeley.

The opening keynote address by Mr Chris Sim discussed the challenges and changes necessary to enable growth and expansion in the industry over the upcoming decade. He emphasized the essential supporting elements and leading approaches required for such enablement. He also highlighted the projects on digital twins SHINE is working on with industries like Micron and AMD.

Dr Suresh Venkatesan’s talk highlighted the growth in photonics-based technologies and the need for an integration solution to “semiconductorize” photonics using wafer-level semiconductor processing. He discussed the key challenges in photonics and established hybrid integration as the most cost-effective deployable solution with its ability to scale and adaptability.

Prof Takao Someya discussed recent advancements in nanomesh electrodes that can be applied directly onto the skin for smart apparel, sensor patch and skin electronics.

Dr Walter Schwarzenbach introduced SmartSiCTM, a solution meeting requirements for power devices, including high-quality and ultra-low resistivity materials.

Dr Desmond Lim shared a case study of miniaturization and the first locally developed synthetic aperture radar (SAR) Microsatellite, NeuSAR, which he said had been a success.

Glenn Vandevoorde followed on starting his talk by introducing iCana, an IC design start-up, and discussing the challenges in RFIC design, including the need for higher power, wider bandwidth, and better efficiency for 5G infrastructure. He emphasized iCana’s focus on developing a complete range of products for 5G infrastructure for FR1 and FR2, and its roadmap for addressing these challenges with novel devices, transcending traditional design trade-offs. Glenn also highlighted the importance of a world-class design team and branding with a deepened understanding of three key challenges, funding, supply chain, and people, and five possible means to boost semiconductor start-ups in Singapore.

Prof Aaron Thean then discussed the increasing emphasis on material innovations, which offer new opportunities, and the motivation behind SHINE, which has a strategy and approaches well-suited for value-adding Singapore’s industry landscape. He emphasized the continuation of circuit density scaling by enabling Design Technology Co-optimization (DTCO) with new computing systems that drive the co-integration of logic and memory. He shared the roadmap on flexible/soft electronics development with increased applications scaling towards diverse sensing power sources, slower but more sophisticated ICs, and hybrid-integrated electronics and heterogeneous integration with the convergence of material innovations. Converging these approaches, SHINE contributes to smart surface-aware remote-sensing skin.

Prof Chen Xiaodong focused on the interconnection and packaging of soft electronics, which are flexible, stretchable, and biocompatible designs, bringing significant changes in electronic devices such as wearable tech, medical devices, and IoT. He shared the technology roadmap of stretchable electronics and discussed the materials, processes, and design strategies for modular connection, leading to a universal interface that can connect soft, rigid, and encapsulation modules efficiently to form reliable, robust, and highly flexible devices. Prof Chen also delved into challenges and opportunities in soft electronics packaging, such as ensuring environmental stability, mechanical durability, and electrical performance while integrating passive and active components.

Dr Bhattacharya presented on System-In-Package (SiP) enabled by heterogeneous integration, allowing the semiconductor industry to create advanced SiP solutions that optimize power-performance-form factor-cost while addressing diverse market requirements for 5G, AI, and HPC market applications. He provided an overview of the challenges, such as thermal cooling, and solutions for designing and manufacturing heterogeneous integrated systems in a package while including developed SiP solutions with versatile platforms: embedded HD FOWLP, 2.5D interposer, and 3D integrated chiplet systems that demonstrated wafer level heterogeneous integration of chiplets for 5G/AI/HPC applications.

Prof Alberto’s closing keynote discussed the challenges in designing semiconductors for the lack of designers and inherent issues in product development involving billions of transistors, especially with chiplets intensifying complexities in the design process. He highlighted the need for a holistic consideration of sensors, actuators, communication, and computing elements for integrated system design, with critical decisions on integrated versus multi-chip solutions. With an increasing interest in AI components among computing elements, he also addressed the crucial trade-offs between analog and digital solutions for AI chips while evaluating the general directions of integrated system design such as module-level 3D-IC partitioning and AI computing blocs.

We were thrilled to see experts from academia and industry generously sharing their research inputs and outcomes, and exchanging innovative ideas for the advancement of the semiconductor industry during the 2-day SHINE technical seminar and workshop. The first day of the event successfully concluded at 5 pm.

The second day of the event, which was restricted to SHINE consortium members, focused on a workshop and saw about 90 attendees. Prof Lim, Programme Director of SHINE, recapped the program’s overview and updated the progress of the program since the establishment of the SHINE center on 30 March 2021. A total of nine SHINE PIs and fellow senior researchers shared their ideas and findings on the four thrusts of research: Functional Materials, Processing and Sensors; Elastomeric Composites for Thermal Interface Materials; Design and Development of the Chiplet-based Heterogeneous Integration on Silicon Interposer for an RF Transceiver; Thermal Management Solution for Flexible Antenna System; Design of Flexible Phased Arrays in SHINE; A Design Methodology for Chiplets: Towards on-, over-the- and across-Chiplet Specialization for High-Mix Low-Volume Heterogeneous Systems; and Additive Manufacturing of Nanomaterial for Thermal Management of Integrated Microelectronics.

The workshop was dynamic and interactive, with participants actively raising questions and engaging in productive discussions. The workshop concluded smoothly at 5 pm, leaving everyone with new insights and ideas to take forward in their work.

Overall, the 2-day SHINE technical seminar and workshop was a success, and we invite everyone to stay tuned for more updates on SHINE’s cutting-edge research in hybrid-integrated next-generation μ-electronics.

For speaker biography and event e-booklet, click here.

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