The session explored the future of these technologies through the lens of imec, the world’s largest independent research and innovation centre for nanoelectronics and digital technology. Founded in 1984, imec is a global leader in nanoelectronics, widely recognized as the “chip lab of the world.” Its research advances smaller, faster, and more energy-efficient chips, addressing pressing global challenges such as climate change, healthcare, and food security. imec’s innovations impact diverse sectors, including consumer electronics, healthcare, and energy systems.

In his seminar, Dr. Paul Heremans articulated imec’s strategic vision and highlighted key research directions including:

• Core semiconductor technologies for next-generation process nodes
• Silicon photonics for quantum computing and photonic control of neutral atoms, ions, and NV centres
• Pixel-level innovations enabling advanced hyperspectral imaging
• Key Technology Themes for Compute Systems
• imec’s strong connection with the academic world nurtures innovative excellence

Participants gained a deeper understanding of major technological challenges, emerging trends, and practical implications for both academia and industry. The seminar concluded with a dynamic Q&A session, reflecting attendees’ engagement and curiosity, underscoring the ongoing relevance and impact of imec’s research in shaping the future of technology.

During the talk, Prof. Takenaka shared how recent advances in silicon-based programmable photonic circuits—made possible through the integration of heterogeneous materials – are unlocking novel device concepts, circuit architectures, and experimental methods. These developments highlight silicon photonics as a scalable, energy‑efficient platform for next‑generation AI hardware. 

Key takeaways included:  

• Photonic processors that enable low-energy multiply–accumulate (MAC) operations.

• Hybrid systems utilizing light for weight distribution and progressing toward fully photonic architectures, with an engaging discussion on achieving the optimal balance between optical and electronic processing.

• The critical role of electronic–photonic integration as a foundation for practical quantum systems.

• The potential for large-scale integration beyond the 128×128 threshold.

The talk drew an extremely strong turnout and was overwhelmingly well received on the floor, culminating in an energetic, extended questions and answers session. The session closed with clear interest in collaborations and follow-up demonstrations, underscoring the momentum behind silicon photonics for next-generation AI and quantum hardware.

The talk highlighted why Si-based qubits are a leading candidate for scaling, leveraging mature semiconductor manufacturing and the prospect of co-integrating qubits with transistors to keep large quantum circuits comparable in footprint to classical processors.

Dr. Vinet presented FDSOI CMOS as a practical platform to co-integrate spin qubits with integrated control/read-out circuits, and shared recent advancements in quantum dot arrays, demonstrating elementary operations at microsecond timescales with state-of-the-art noise performance.

The session also covered FDSOI-based cryo-control electronics, demonstrating elementary control and read-out at cryogenic temperatures, and outlined strategies, as well as key challenges, for co-integrating qubits and integrated circuits at advanced technological nodes.

Participants left with a clearer view of how industry-compatible technologies can accelerate the engineering of “good qubits” and the roadmap to large-scale silicon quantum processors.