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Publications – 2023 – SHINE


On the effect of partial underfilling on the fatigue life of flip-chip micro-solder bumps in a heterogeneously integrated TSI package using finite element simulations

High-Performance Amplifier Package Design for Heterogenous Integration on Si-interposer

Overcoming Negative nFET VTH by Defect-Compensated Low-Thermal Budget ITO-IGZO Hetero-Oxide Channel to Achieve Record Mobility and Enhancement-mode Operation

N-P Reconfigurable Dual-Mode Memtransistors for Compact Bio-Inspired Feature Extractor with Inhibitory-Excitatory Spiking Capability

Non-Hermitian Chiral Heat Transport

Observation of Bulk Quadrupole in Topological Heat Transport

DOA estimation for Cylindrical Antenna Arrays using Cramer-Rao Lower Bound Analysis

Hydrogels for Flexible Electronics

Enhancing Prosthetic Control through High-Fidelity Myoelectric Mapping with Molecular Anchoring Technology

BEOL Compatible Extremely Scaled Bilayer ITO/IGZO Channel FET with High Mobility 106cm 2 /V.s

Back-End-of-Line-Compatible Anneal-Free Ferroelectric Field-Effect Transistor

Microneedle-Coupled Epidermal Sensors for In-Situ-Multiplexed Ion Detection in Interstitial Fluids

Technology Roadmap for Flexible Sensors

A Universal Interface for Plug-and-play Assembly of Stretchable Devices

High-Performance Top-Gated and Double-Gated Oxide–Semiconductor Ferroelectric Field-Effect Transistor Enabled by Channel Defect Self-Compensation Effect

Low-Thermal-Budget BEOL-Compatible Beyond-Silicon Transistor Technologies for Future Monolithic-3D Compute and Memory Applications



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