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Nondestructive Sensing of Plant-Borne Chemicals: Biomarkers, Agrochemicals, and Pollutants June 6, 2025

Publication

Nondestructive Sensing of Plant-Borne Chemicals: Biomarkers, Agrochemicals, and Pollutants

June 6, 2025

This review presents recent advancements in the use of nondestructive methods for plant chemical sensing. It summarizes the different environmental chemicals and plant biomarkers used for assessing plant health. The article also discusses various types of sensing devices and techniques, along with the emerging use of flexible and wearable devices on plants.

Researcher/Author:

Dr Yi Jing Wong, Dr Yifei Luo, Dr Xian Jun Loh, Prof Xiaodong Chen

Published in: Chemistry Europe (06 June 2025)

To download the paper, please proceed to:

DOI: https://doi.org/10.1002/anse.202500037

Msc in Semiconductor Technology and Operations in Vol 31 of Voice Magazine March 28, 2024

https://ssia.org.sg/wp-content/uploads/2024/03/VOICE31-March2024.pdf

Event Broadcast Draft 1 September 28, 2022

Guest of Honour

Welcome Address

BG Ng Chad-Son
Deputy Secretary (Technology)
Ministry of Defence

Prof Aaron Thean
Director
SHINE Centre

Keynotes

Hybrid Integration Platform for Co-Packaged Photonics Using POET’s CMOS Based Optical Interposer

Dr Suresh Venkatesan
Chairman & Chief Executive Officer POET Technologies, Inc

Accelerated Innovation: Materials Developments to Enable
Continued Device Miniaturization

Dr Thomas J. Knisley
Applied Materials

3D MOSAIC of N3XT Chips:
Domain-Specific Technology for Future Systems

Prof Philip Wong
Electrical Engineering
Stanford University

Advanced Flexible Microelectronics

Prof Takao Someya Department of Electrical and Electronic Engineering University of Tokyo

This is a paragraph.

Substrates Engineering for Microelectronics

Ms Nguyen Bich-Yen
Senior Fellow
SOITEC

Invited Talks

Advanced Additive Manufacturing of Nano & Microelectronics

Prof Ahmed Busnaina
William Lincoln Smith Chair Professor, Distinguished Professor Northeastern University

Electronic Design Automation and Chip Design for Heterogeneous Integration

Prof Alberto Sangiovanni Vincentelli
Buttner Chair of EECS
University of California, Berkeley

Advanced HI Overview
System-in-Package Integration for Diverse Applications

Dr Surya Bhattacharya
MicroE 2.0 HI Task Force
Director, A*STAR IME

RF Enabling Technologies

Dr Vincent Leong
Director
DSO

Future Integration Technologies for High-end Automotive Electronics

Mr Markus Bebendorf
Group Manager
Continental Automotive

Latest Advancement in Semiconductor Package Fault Isolation

Mr Chin Jiann Min
Director
AMD Singapore

For event details, click here.

Exhibiter List

Location Map

Driver is advised to enter via Engineering Drive 1 and park at cark park C at Block E6.

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