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HOME
ABOUT
Vision & Mission
Director Message
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10.6 µW Peak Power for Purely- Harvested Green Systems
1T1R and 2TOC1R IGZO-MoS₂ All-BEOL 3D Memory Cells
42.8 pW Power and 10.4% Accuracy across Corner Wafers in 180 nm
500um2
A 0.4V 12b Comparator Offset Injection Assisted SAR ADC achieving 0.425 fJ/conv-step
A C-band Dual-pol Compact Reflector Antenna with a Square Waveguide Feed
A Conformal L-band Array with Multi-Polarization Digital Beamforming and Sidelobe Suppression
A Dual-Polarized 4×4 L-band Digital Beamforming Receiving Array with Synchronized RFSoCs
A Resistor/Trimming-Less Self-Biased Current Reference Class with Area Down to $3
An Antidehydration Hydrogel Based on Zwitterionic Oligomers for Bioelectronic Interfacing
An L-band Array with LCMV Beamforming Using the Xilinx RFSoC
An L-band Receiving Array with Full Digital Simultaneous Quad-Polarization Beamforming
and No High-Voltage CMOS Process
and Robust Wearable Strain Sensor Based on CNTs/AgNWs Nanocomposite for Health and Fitness Monitoring
Annealing
Artificial Neuron Devices
Asian Deans' Forum Visit to SHINE Centre | 18 Nov 2024
Back end of line
Building the Semiconductor Equipment Ecosystem in Singapore
Deployable L-Band Bowtie Antenna Array for Satellite Applications
DOA Estimation for Curved Antenna Arrays Using CRLB Analysis and SDR
DOA estimation for Cylindrical Antenna Arrays using Cramer-Rao Lower Bound Analysis
Driving Semiconductor Innovation for AI
Dual- Function Harvesting from Breathing
Dual-Polarized and Fully Conformal Antenna using Stacked Semi-Elliptical Shaped Polyimide Films
Dual-Polarized and Multi-Axis Foldable Antenna Using Sequentially Arranged Conformal Patches
E-Textile Battery-Less Walking Step Counting System with <23 pW Power
Efficient Calibration of RFSoC Full Digital Receiving Beamformer
Enhancing Prosthetic Control through High-Fidelity Myoelectric Mapping with Molecular Anchoring Technology
Estimation of Element Positions in Deformed Uniform Linear Arrays using Received Signals
Estimation of Phased Array Deformation Using Two Received Noisy Signals
Exploring Defects & Structures. Microscopy Solutions for Advanced Semiconductor Packaging; Failure Analysis
Fault location in Ciruitry using magnetic field
Ferroelectric field-effect transistor
First Demonstration of HZO-LNOI Integrated Ferroelectric Electro-Optic Modulator and Memory to Enable Reconfigurable Photonic Systems
Flexible and Conformal Antennas Based on Corrugated Copper Clad Polyimide Films
Flexible and Printable Composite Ink for Thermal Management of Soft Electronics
Flexible and Stretchable Antenna Using Corrugated Copper-Clad Polyimide and Beyolex Film
Flexible Dual Linear Polarized H-shaped Aperture Coupled Antenna with High Port Isolation
Foldable Dual Linear Polarized Dipole L band Antenna Using Polyimide and Gamma Match
FScaled Bilayer
Future Directions for Moore's Law and Advanced Packaging
High Mobility
High-Performance Amplifier Package Design for Heterogenous Integration on Si-interposer
Highly Flexible and Conformal Stacked Antenna Using Uneven-spaced Corrugated Mesh Patterns
Highly Flexible and Conformal Stacked Patch Filtering Antenna Using Transparent FEP Films
Highly Flexible and Deployable Antenna Array Using Double-arch-shaped PTFE Films
Highly Flexible and Foldable Antenna Array using Corrugated CCPM-based Patches
Highly Stretchable
Hydrogels for Flexible Electronics
Hygroscopic Solutes Enable Non-van der Waals Electrolytes for Fire-Tolerant Dual-Air
Impact of Deformations on Beamforming Performance of Uniform Rectangular Arrays
Integrated multimodal sensing for scent digitalization
Interfacing Neuron-Motor Pathways with Stretchable and Biocompatible Electrode Arrays
ITo/IGZo Channel FET
L-Band Antenna with Frequency-Dependent Patterns Using an Optimized Parasitic Pixel Layer
L-band Array with Full Digital Beamforming Using the Xilinx RFSoC
Low Profile Shared Aperture Antennas for Dual Band Space Applications
magnetic field
Material Innovation in the Atomic Scale Era - An Industry Perspective
Microneedle-Coupled Epidermal Sensors for In-Situ-Multiplexed Ion Detection in Interstitial Fluids
Mitigating the Overheat of Stretchable Electronic Devices Via High-Enthalpy Thermal Dissipation of Hydrogel Encapsulation
Multilayer and Lightweight Conformal Antenna Using U-Slotted Patch and Stacked Polyimide Films
Multilayer and Low-Profile Optically Semi- Transparent Antenna for Conformal Applications
N-P Reconfigurable Dual-Mode Memtransistors for Compact Bio-Inspired Feature Extractor with Inhibitory-Excitatory Spiking Capability
Negative-U Defect Passivation in Oxide-Semiconductor by Channel Defect Self-Compensation Effect to achieve Low Bias Stress VTH Instability of Low-Thermal Budget IGZO TFT and FeFETs
On the effect of partial underfilling on the fatigue life of flip-chip micro-solder bumps in a heterogeneously integrated TSI package using finite element simulations
Overcoming Negative nFET VTH by Defect-Compensated Low-Thermal Budget ITO-IGZO Hetero-Oxide Channel to Achieve Record Mobility and Enhancement-mode Operation
Rapid-Response Water-Shrink Films with High Output Work Density Based on Polyethylene Oxide and 𝜶-Cyclodextrin for Autonomous Wound Closure
Recent Progress in MXene-Based Electrochemical Actuators and Capacitors
Reconfigurable Quad-polarization L-band Antenna
Resilient conductive membrane synthesized by in-situ polymerisation for wearable non-invasive electronics on moving appendages of cyborg insect
Sensitive
SHINE Overseas Speaker Series Workshop on "Future Directions for Moore's Law and Advanced Packaging" | 29 Oct 2024
Single-Antenna Backscattered BLE5 Transmitter with up to 97m Range
Size-Selective Ionic Crosslinking Provides Stretchable Mixed Ionic–Electronic Conductors
Solution-processable 2D materials for monolithic 3D memory-sensingcomputing platforms: opportunities and challenges
Talk on 'Compute Scaling Beyond the finFET Era: The Road to CMOS 2.0'
Talk on 'Logic Technology Roadmap for the Trillion Transistor Era'
TSMC Visit to SHINE Centre | 21 May 2024
Wafer-scale solution-processed 2D material analog resistive memory array for memory-based computing
X-Band Receiving Phased Array with Digital Beamforming Using RFSoC
x-ray
Exploring Defects & Structures. Microscopy Solutions for Advanced Semiconductor Packaging; Failure Analysis
SHINE ZEISS Joint Seminar: Exploring Defects & Structures. Microscopy Solutions for Advanced Semiconductor Packaging
March 13, 2025
Home
Exploring Defects & Structures. Microscopy Solutions for Advanced Semiconductor Packaging; Failure Analysis
