Sidebar
×
Main Menu
HOME
ABOUT
Vision & Mission
Director Message
The Sponsors
Academic Partners
Industry Partners
PEOPLE
PARTNERSHIP
OUR RESEARCH
THE FACILITIES
MASTER OF SCIENCE
NEWS & UPDATES
News & Events
Publications
CAREER
CONTACT
E6NanoFab
Map
Staff
Student
HOME
ABOUT
Vision & Mission
Director Message
The Sponsors
Academic Partners
Industry Partners
PEOPLE
PARTNERSHIP
OUR RESEARCH
THE FACILITIES
MASTER OF SCIENCE
NEWS & UPDATES
News & Events
Publications
CAREER
CONTACT
10.6 µW Peak Power for Purely- Harvested Green Systems
42.8 pW Power and 10.4% Accuracy across Corner Wafers in 180 nm
500um2
A 0.4V 12b Comparator Offset Injection Assisted SAR ADC achieving 0.425 fJ/conv-step
A C-band Dual-pol Compact Reflector Antenna with a Square Waveguide Feed
A Resistor/Trimming-Less Self-Biased Current Reference Class with Area Down to $3
An Antidehydration Hydrogel Based on Zwitterionic Oligomers for Bioelectronic Interfacing
An L-band Array with LCMV Beamforming Using the Xilinx RFSoC
Annealing
Artificial Neuron Devices
Back end of line
Building the Semiconductor Equipment Ecosystem in Singapore
Compute Scaling Beyond the finFET Era: The Road to CMOS 2.0
Deployable L-Band Bowtie Antenna Array for Satellite Applications
DOA Estimation for Curved Antenna Arrays Using CRLB Analysis and SDR
DOA estimation for Cylindrical Antenna Arrays using Cramer-Rao Lower Bound Analysis
Driving Semiconductor Innovation for AI
Enhancing Prosthetic Control through High-Fidelity Myoelectric Mapping with Molecular Anchoring Technology
Estimation of Element Positions in Deformed Uniform Linear Arrays using Received Signals
Fault location in Ciruitry using magnetic field
Ferroelectric field-effect transistor
First Demonstration of HZO-LNOI Integrated Ferroelectric Electro-Optic Modulator and Memory to Enable Reconfigurable Photonic Systems
Flexible and Printable Composite Ink for Thermal Management of Soft Electronics
FScaled Bilayer
High Mobility
High-Performance Amplifier Package Design for Heterogenous Integration on Si-interposer
Hydrogels for Flexible Electronics
Hygroscopic Solutes Enable Non-van der Waals Electrolytes for Fire-Tolerant Dual-Air
ITo/IGZo Channel FET
L-band Array with Full Digital Beamforming Using the Xilinx RFSoC
Logic Technology Roadmap for the Trillion Transistor Era
magnetic field
Microneedle-Coupled Epidermal Sensors for In-Situ-Multiplexed Ion Detection in Interstitial Fluids
N-P Reconfigurable Dual-Mode Memtransistors for Compact Bio-Inspired Feature Extractor with Inhibitory-Excitatory Spiking Capability
Negative-U Defect Passivation in Oxide-Semiconductor by Channel Defect Self-Compensation Effect to achieve Low Bias Stress VTH Instability of Low-Thermal Budget IGZO TFT and FeFETs
On the effect of partial underfilling on the fatigue life of flip-chip micro-solder bumps in a heterogeneously integrated TSI package using finite element simulations
Overcoming Negative nFET VTH by Defect-Compensated Low-Thermal Budget ITO-IGZO Hetero-Oxide Channel to Achieve Record Mobility and Enhancement-mode Operation
Reconfigurable Quad-polarization L-band Antenna
Resilient conductive membrane synthesized by in-situ polymerisation for wearable non-invasive electronics on moving appendages of cyborg insect
Single-Antenna Backscattered BLE5 Transmitter with up to 97m Range
Size-Selective Ionic Crosslinking Provides Stretchable Mixed Ionic–Electronic Conductors
Talk on 'Compute Scaling Beyond the finFET Era: The Road to CMOS 2.0'
Talk on 'Logic Technology Roadmap for the Trillion Transistor Era'
TSMC Visit to SHINE Centre | 21 May 2024
x-ray
High-Performance Amplifier Package Design for Heterogenous Integration on Si-interposer
High-Performance Amplifier Package Design for Heterogenous Integration on Si-interposer
August 3, 2023
Home
High-Performance Amplifier Package Design for Heterogenous Integration on Si-interposer
