Speaker Biography of Invited Talks
Prof Lim Yeow Kheng is the Programme Director of the SHINE Centre and the Master of Science in Semiconductor Technology and Operations (STO) programme at the National University of Singapore (NUS). He also serves as Assistant Dean (Research and Technology) and Professor in the Department of Electrical and Computer Engineering at the College of Design and Engineering. With over 20 years of industry experience in semiconductor technology and OSAT manufacturing, Prof. Lim has held leadership roles at GlobalFoundries and JCET Group.
His research interests span advanced wafer-level packaging, heterogeneous integration, nanomaterials, flexible electronics, and AI/ML applications. He is a Senior Member of IEEE, holds multiple patents, and is active in numerous local and international technical committees and conferences in microelectronics and packaging technologies.
Kaustav Banerjee is a Professor of Electrical and Computer Engineering and Director of the Nanoelectronics Research Lab at the University of California, Santa Barbara. His research positions two-dimensional (2D) materials as foundational platforms for scalable, energy-efficient nanoelectronics, encompassing transistors, interconnects, RF passives, and monolithic three-dimensional integration. He is widely recognized for pioneering device-physics-driven and predictive frameworks that establish the fundamental limits of silicon–copper technologies and define manufacturable pathways beyond them. His work has significantly influenced industrial technology roadmaps, including advanced interconnect strategies, and is being translated through Destination 2D, a company he co-founded.
Professor Banerjee is a Fellow of the IEEE, APS, AAAS, JSPS, and AIIA, and a Clarivate Highly Cited Researcher. His international honors include the Humboldt Foundation’s Bessel Prize, the JSAP Fellow International Award from the Japan Society of Applied Physics, and the IEEE Kiyo Tomiyasu Award. He received his Ph.D. in Electrical Engineering and Computer Sciences from the University of California, Berkeley.
Prof. Nagarajan is currently Senior Vice President and Chief Technology Officer of Marvell’s Optical Engineering Group, where he leads the development of the company’s optical platform products and technologies. Concurrently, he serves as a Visiting Professor in the Department of Electrical and Computer Engineering at the National University of Singapore. He received his B.Eng. from NUS, M.Eng. from the University of Tokyo, and Ph.D. from the University of California, Santa Barbara, all in Electrical Engineering.
Dr. Nagarajan is an elected member of the U.S. National Academy of Engineering. His recognitions include the IEEE/LEOS Aron Kressel Award, the IPRM Award, and the Optica David Richardson Medal for his breakthrough contributions to the development and manufacturing of photonic integrated circuits. He holds over 250 U.S. patents and is a Fellow of the IEEE, Optica (formerly the Optical Society), and the IET.
Subramanian S. Iyer (Subu) is a Distinguished Professor and holder of the Charles P. Reames Endowed Chair in the Department of Electrical Engineering, with a joint appointment in the Department of Materials Science and Engineering at the University of California, Los Angeles (UCLA). During 2023–2024, he served on assignment to the U.S. Department of Commerce as Director of the National Advanced Packaging Manufacturing Program, where he established the foundational strategy for the national advanced packaging initiative. He is the founding Director of the UCLA Center for Heterogeneous Integration and Performance Scaling (CHIPS). Prior to joining UCLA, he was an IBM Fellow.
Professor Iyer’s seminal technical contributions include the development of the world’s first SiGe base HBT, salicide technology, electrical fuses, embedded DRAM, and the 45 nm technology node that enabled the first generation of truly low-power portable devices, as well as the first commercial interposer and 3D integrated products. At UCLA, his research focuses on next-generation packaging paradigms and device innovations aimed at enabling wafer-scale architectures, in-memory computing, and medical engineering applications.
He is a Fellow of the IEEE, APS, iMAPS, and the National Academy of Inventors (NAI), and a Distinguished Lecturer of the IEEE Electron Devices Society (EDS) and Electronics Packaging Society (EPS). He is a Distinguished Alumnus of IIT Bombay and has received numerous honors, including the IEEE Daniel Noble Medal for Emerging Technologies (2012), the iMAPS Daniel C. Hughes Jr. Memorial Award (2020), and the iMAPS Distinguished Educator Award (2021).
Dr. Alfred Yeo is an R&D Director at STATS ChipPAC Singapore, bringing over 25 years of experience in the semiconductor industry. His career includes senior technical roles at Infineon, GlobalFoundries, and Advanced Micro Devices, where he contributed to advanced packaging and manufacturing technologies.
His expertise spans semiconductor packaging, with particular strengths in chip–package interaction (CPI) design, modeling and simulation, process engineering, assembly metrology, prototyping, reliability, and product lifecycle management. Dr. Yeo holds a Ph.D., M.Eng., and B.Eng. (Hons) from Nanyang Technological University, Singapore.
Dr. Shyam Surthi is a Distinguished Member of Technical Staff in the Advanced NAND Technology team and is currently based in Singapore. He holds a B.S. and M.S. in Chemical Engineering from the University Institute of Chemical Technology, Mumbai, and a Ph.D. in Electrical Engineering from the University of Alabama, where he specialized in the processing and characterization of perovskite materials. He subsequently served as a Postdoctoral Fellow at North Carolina State University, focusing on the development of silicon-based molecular devices for memory applications.
Dr. Surthi joined Micron Technology in 2004 in Diffusion Process Development, working on a wide range of thin-film development projects before transitioning to Advanced DRAM Process Integration. Since 2011, he has held multiple people and technical leadership roles in films process development for DRAM and emerging memory technologies, and in NAND pathfinding, with a strong emphasis on process integration.
He is a Senior Member of the IEEE, holds 72 U.S. patents along with several international patents, and has authored more than 25 publications in refereed journals and conference proceedings.
Speaker Biography of Invited Talks (more info is available in the event booklet)
Alberto Sangiovanni Vincentelli is the Edgar L. and Harold H. Buttner Chair of Electrical Engineering and Computer Sciences at the University of California, Berkeley. He is the author or co-author of over 1,000 publications, 17 books, and three patents, with contributions spanning design tools and methodologies, large-scale systems, embedded and hybrid systems, and artificial intelligence. He is a co-founder of Cadence and Synopsys, the two leading companies in Electronic Design Automation (EDA).
Professor Sangiovanni Vincentelli is a Fellow of the IEEE and ACM and a member of the U.S. National Academy of Engineering. He has served as a consultant or advisory board member to numerous global organizations, including BMW, Mercedes-Benz, Magneti Marelli, Intel, STMicroelectronics, HP, General Motors, United Technologies, Lutron, Lendlease, and Elettronica. He currently serves on the boards of Cadence, KPIT Technologies, eGap, Exein, and Cy4Gate, and is Chairman of the Board of Quantum Motion, Innatera, Phoelex, e4Life, and Phononic Vibes.
From 2001 to 2015, he was a member of the Scientific Council of the Italian National Research Council (CNR). Between 2010 and 2020, he served on the Executive Committee of the Italian Institute of Technology, where he is now a member of the Technical-Scientific Committee. In September 2023, he was appointed President of Chips.it, a €250 million foundation of the Italian Government dedicated to advancing integrated circuit design. He also serves as Chairperson of the Strategy Board and the International Advisory Board of the Milano Innovation District (MIND).
His honors include numerous academic and research awards, notably the IEEE/RSE Wolfson James Clerk Maxwell Medal—for groundbreaking contributions with exceptional impact on electronics and electrical engineering—and the BBVA Frontiers of Knowledge Award in Information and Communication Technologies, recognizing his role in transforming chip design from a handcrafted process into today’s automated industry. He received his degree in Electrical Engineering and Computer Science (summa cum laude) from the Politecnico di Milano in 1971, and holds four Honorary Doctorates from Aalborg University, KTH Royal Institute of Technology, AGH University of Science and Technology, and the University of Rome Tor Vergata.
Prof. Massimo Alioto is the Provost’s Chair Professor in the Department of Electrical and Computer Engineering at the National University of Singapore, where he leads the Green IC Group and the Integrated Circuits and Embedded Systems area. He has held previous positions at the University of Siena, Intel Labs (2013), University of Michigan, Ann Arbor (2011–2012), University of California, Berkeley (2009–2011), and EPFL.
Prof. Alioto is the (co)author of over 400 publications in journals and conference proceedings, and four books with Springer, with two more forthcoming. His primary research interests include ultra-low-power and self-powered systems, green computing, circuits for machine intelligence, hardware security, and other emerging technologies.
He has served in numerous editorial and leadership roles, including Editor-in-Chief of IEEE TVLSI, Deputy Editor-in-Chief of IEEE JETCAS, and Associate Editor of the flagship journal of the IEEE Solid-State Circuits Society. He has also been Chair of the Distinguished Lecturer Program for the IEEE CAS Society and a Distinguished Lecturer for both the SSC and CAS Societies. Currently, he serves on the Administrative Committee (AdCom) of the IEEE Solid-State Circuits Society.
Prof. Alioto has chaired the “VLSI Systems and Applications” Technical Committee of the IEEE Circuits and Systems Society (2010–2012), served as Guest Editor for numerous special journal issues, and held leadership roles in IEEE conferences as Technical Program Chair (ISCAS, SOCC, PRIME, ICECS) and TPC member (ISSCC, ASSCC). His research group’s work has earned multiple best paper awards, recognition in TSMC’s top ten technological highlights, and other accolades.
He is a Fellow of the IEEE.
Dr. Li Yanzhen is a Research Fellow in the School of Materials Science and Engineering at Nanyang Technological University, where he also earned his Ph.D. He holds a B.Sc. in Materials Science and Physics from Nanjing University. His research focuses on mechanical sensors and flexible electronic devices, with particular emphasis on structure-driven design and system-level integration.
Prof. Pooi See Lee is the President’s Chair Professor in Materials Science & Engineering at Nanyang Technological University (NTU). Her research focuses on deformable electroactive composites for soft actuators, sensors, and energy devices.
Professor Lee has received numerous accolades, including the Nanyang Research Award (2016), the Nanyang Award for Innovation and Entrepreneurship (2018), and the NRF Investigatorship (2016). She has been recognized as a Highly Cited Researcher by Clarivate Analytics from 2018 to 2024, and received the SNIC-AsCA Distinguished Woman Chemist Award (2022). She is a Fellow of the National Academy of Inventors (2020), MRS (2022), and RSC (2022).
Dr. Yizhou Jiang is a Research Fellow at the Singapore Hybrid-Integrated Next-Generation μElectronics Centre. He earned his Ph.D. in 2023 from the School of Information Science and Technology, Fudan University, China. His research focuses on the co-design, hybrid integration, and optimization of solid-state circuits with flexible electronics and emerging devices. Dr. Jiang joined the National University of Singapore in 2023.
Prof. Koen Mouthaan received his M.Sc. and Ph.D. in Electrical Engineering from Delft University of Technology, Netherlands. He has held research and industry roles at TNO Defense, Safety and Security and SkyGate, a company specializing in phased-array antennas for consumer applications. Between 2003 and 2015, he served as Assistant Professor and later Tenured Associate Professor in the Department of Electrical and Computer Engineering at the National University of Singapore (NUS), rejoining the department in 2016.
Prof. Mouthaan’s research focuses on microwave and millimeter-wave circuits and systems, phased-array antennas, digital beamforming, and innovative design methodologies. He also holds an MBA from Nanyang Technological University, an M.Sc. in Organizational Leadership from Johns Hopkins University, and a Master in Space Engineering from the Technical University of Berlin.
Dr. Lim Teck Guan is a Principal Scientist and Team Lead of the System-in-Package Research Group at IME. His research focuses on advanced packaging and integration technologies for RF/millimeter-wave and photonic circuits.
Dr. Chua Yun Da is a Research Fellow at the Singapore Hybrid-Integrated Next-Generation μ-Electronics Centre, where he contributes to cutting-edge research in hybrid-integrated microelectronics.
The Agenda
Event Location
Venue: NUS College of Design and Engineering Campus,
Block EA, Auditorium, 9 Engineering Drive 1, S(117575)
Driver is advised to enter via the Engineering Drive 1 and park at car park 2A/2B.
