Hygroscopic Solutes Enable Non-van der Waals Electrolytes for Fire-Tolerant Dual-Air Batteries Read More » January 5, 2024
On the effect of partial underfilling on the fatigue life of flip-chip micro-solder bumps in a heterogeneously integrated TSI package using finite element simulations Read More » August 3, 2023
High-Performance Amplifier Package Design for Heterogenous Integration on Si-interposer Read More » August 3, 2023
Overcoming Negative nFET VTH by Defect-Compensated Low-Thermal Budget ITO-IGZO Hetero-Oxide Channel to Achieve Record Mobility and Enhancement-mode Operation Read More » July 24, 2023
N-P Reconfigurable Dual-Mode Memtransistors for Compact Bio-Inspired Feature Extractor with Inhibitory-Excitatory Spiking Capability Read More » July 12, 2023
Engineered Nucleotide Chemicapacitive Microsensor Array Augmented with Physics-Guided Machine Learning for High-Throughput Screening of Cannabidiol Read More » May 6, 2022
Stress-Memorized HZO for High-Performance Ferroelectric Field-Effect Memtransistor Read More » April 13, 2022
A Wafer Scale Hybrid Integration Platform for Co-packaged Photonics using a CMOS based Optical Interposer Read More » April 1, 2022
